Thermal and Thermomechanical Analysis and Testing of Electronic Packaging Systems
نویسندگان
چکیده
A comprehensive thermal and mechanical modeling and experimentation program in advanced packaging has led to the systematic thermomechanical analysis of very large scale integrated device packages, board-level structures, and surface-mounted electronic systems. Model validation and analytical results have been correlated with data from extensive experimental testing, and new techniques have been developed for the production of high-reliability, controlled-geometry solder joints for large leadless ceramic chip carriers.
منابع مشابه
Thermomechanical Analysis of Exhaust Manifold and Catalyst for with Fluid Structure Interaction
Design of exhaust manifold is important due to its effects on performance of catalyst, thermal and thermo- mechanical loads. In this paper, first transient analysis of fluid was carried out with FLUENT software, then time-average temperature and heat transfer coefficient contour for three cycle were mapped on inner surface of exhaust manifold with MATLAB software for thermomechanical analysis. ...
متن کاملThermomechanical Analysis of Electronic Package Using Finite Element Method
This paper deals with the simulation of power electronic components. More precisely it is focused on the modeling approach to emphasize the electro-thermomechanical behavior of materials in power electronics assembly (electronic package). Thermal strains and Stresses constitute an important part of the design considerations for many practical engineering problems. They become especially critica...
متن کاملFatigue and Fracture Assessment for Reliability of Electronics Packaging
Modern electronics products move in the direction of complex, high density, high speed and also thinner and lighter for portability. Reliability of interconnection of electronics packaging has become critical issue. Major functions of electronic packaging are briefly discussed and failure mechanisms of electronic packaging are explained. Electronics packaging is subjected to mechanical vibratio...
متن کاملThermomechanical Stress Analysis of Multi - Layered Electronic Packaging
An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in ...
متن کاملThermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1 Theory and Formulation
Accurate prediction of the thermomechanical cyclic behavior of joints and interfaces in semiconductor devices is essential for their reliable design. In order to understand and predict the behavior of such interfaces there is a need for improved and unified constitutive models that can include elastic, inelastic, viscous, and temperature dependent microstructural behavior. Furthermore, such uni...
متن کامل